BN · rank #2 · 2026-10-19
BESI
AMSTERDAM · EUR · $13.83B (USD)
The exact numbers the algorithm saw.
| Composite score Z-score blend of the factors below; drives the rank. | 1.48 |
|---|---|
| Forward revenue growth Consensus forward revenue growth. | +33.9% |
| Forward net margin Consensus forward net margin. | +31.5% |
| Net margin TTM Trailing twelve month net margin. | +28.4% |
| Margin expansion Forward minus trailing net margin (percentage points). | +3.1% |
| Forward PEG Forward P/E to growth. Below 1 is cheap for the growth. | 0.64 |
| Debt / FCF Net debt relative to free cash flow. Lower is safer. | 1.48× |
| Analyst upside Spread between the consensus 12m target and the current price. | +73.9% |
| Last EPS surprise Most recent reported EPS versus consensus. | -3% |
| Market cap (USD) | $13.83B |
The AI research card
Independent qualitative review of each pick before the order is placed. On the rare day the research service is unavailable, the paper book trades on the quant ranking alone and no card appears here.
Summary
BE Semiconductor Industries NV (BESI) supplies advanced assembly and packaging equipment, leading in hybrid bonding systems for next-generation 2.5D/3D semiconductor architectures.
Rationale
High forward revenue growth (33.9%) and strong margins are backed by a 128.8% YoY Q2 2026 order surge, directly addressing 2.5D/3D packaging bottlenecks in AI and memory applications.
Material risks
- 1Major memory manufacturers delaying hybrid-bonding adoption in favor of extending conventional thermo-compression bonding (TCB) capacity.
- 2Emerging intellectual property and competitive entry from ASML in bonding metrology/hardware, alongside direct packaging competition from ASMPT.
AI verdict council
Each pick is reviewed independently by 3 models before any order. 2 of 3 voted to proceed.