BN · rank #2 · 2026-10-20
BESI
AMSTERDAM · EUR · $14.27B (USD)
The exact numbers the algorithm saw.
| Composite score Z-score blend of the factors below; drives the rank. | 1.11 |
|---|---|
| Forward revenue growth Consensus forward revenue growth. | +33.1% |
| Forward net margin Consensus forward net margin. | +31.5% |
| Net margin TTM Trailing twelve month net margin. | +28.4% |
| Margin expansion Forward minus trailing net margin (percentage points). | +3.1% |
| Forward PEG Forward P/E to growth. Below 1 is cheap for the growth. | 0.64 |
| Debt / FCF Net debt relative to free cash flow. Lower is safer. | 1.48× |
| Analyst upside Spread between the consensus 12m target and the current price. | +66.4% |
| Last EPS surprise Most recent reported EPS versus consensus. | -3% |
| Market cap (USD) | $14.27B |
The AI research card
Independent qualitative review of each pick before the order is placed. On the rare day the research service is unavailable, the paper book trades on the quant ranking alone and no card appears here.
Summary
BE Semiconductor Industries NV develops and manufactures advanced semiconductor packaging equipment, including high-precision die attach and copper-to-copper hybrid bonding systems for logic and memory producers.
Rationale
High AI chip packaging demand drove H1-26 orders up 116.5% year-over-year and expanded hybrid bonding adoption to 21 customers, validating BESI as a critical bottleneck solver in 3D semiconductor assembly.
Material risks
- 1Encroachment by competitors such as ASMPT, EV Group, SUSS MicroTec, and Samsung Semes could erode market share or commoditize hybrid bonding tools.
- 2High customer and regional concentration in Asia (~76% of 2025 revenue) exposes BESI to trade restrictions and order volatility from major logic and memory makers.
AI verdict council
Each pick is reviewed independently by 3 models before any order. 2 of 3 voted to proceed.