BN · rank #5 · 2026-10-21
SMHN
XETRA · EUR · $1.16B (USD)
The exact numbers the algorithm saw.
| Composite score Z-score blend of the factors below; drives the rank. | 0.83 |
|---|---|
| Forward revenue growth Consensus forward revenue growth. | +37.9% |
| Forward net margin Consensus forward net margin. | +9.8% |
| Net margin TTM Trailing twelve month net margin. | +5.9% |
| Margin expansion Forward minus trailing net margin (percentage points). | +3.9% |
| Forward PEG Forward P/E to growth. Below 1 is cheap for the growth. | 4.20 |
| Debt / FCF Net debt relative to free cash flow. Lower is safer. | 2.21× |
| Analyst upside Spread between the consensus 12m target and the current price. | +104.5% |
| Last EPS surprise Most recent reported EPS versus consensus. | -27% |
| Market cap (USD) | $1.16B |
The AI research card
Independent qualitative review of each pick before the order is placed. On the rare day the research service is unavailable, the paper book trades on the quant ranking alone and no card appears here.
Summary
SÜSS MicroTec SE produces semiconductor processing equipment, specializing in temporary bonding, debonding, hybrid bonding, and coaters/developers critical for high-bandwidth memory (HBM) and CoWoS advanced packaging.
Rationale
The quant signal targets SÜSS as an AI hardware bottleneck solver, supported by record H1 order intake of €410.0 million and a record €473.7 million backlog providing multi-year revenue visibility into 2027.
Material risks
- 1Key HBM memory customers may transition away from temporary bonding or internally develop alternative bonding/debonding processes for HBM4 architectures, undermining demand for SÜSS's core platforms.
- 2Specialized competitors like EV Group, Besi, ASMPT, and Tokyo Electron could displace SÜSS in next-generation hybrid bonding or layer-release steps.
AI verdict council
Each pick is reviewed independently by 3 models before any order. 1 of 3 voted to proceed.