BN · rank #5 · 2026-10-22
SMHN
XETRA · EUR · $1.16B (USD)
The exact numbers the algorithm saw.
| Composite score Z-score blend of the factors below; drives the rank. | 0.83 |
|---|---|
| Forward revenue growth Consensus forward revenue growth. | +37.9% |
| Forward net margin Consensus forward net margin. | +9.8% |
| Net margin TTM Trailing twelve month net margin. | +5.9% |
| Margin expansion Forward minus trailing net margin (percentage points). | +3.9% |
| Forward PEG Forward P/E to growth. Below 1 is cheap for the growth. | 4.20 |
| Debt / FCF Net debt relative to free cash flow. Lower is safer. | 2.21× |
| Analyst upside Spread between the consensus 12m target and the current price. | +99.2% |
| Last EPS surprise Most recent reported EPS versus consensus. | -27% |
| Market cap (USD) | $1.16B |
The AI research card
Independent qualitative review of each pick before the order is placed. On the rare day the research service is unavailable, the paper book trades on the quant ranking alone and no card appears here.
Summary
SÜSS MicroTec SE supplies advanced packaging equipment, including temporary bonders, debonders, coaters/developers, and hybrid bonding platforms critical for HBM and CoWoS AI chip manufacturing.
Rationale
Record H1 2026 order intake of €410.0M and a €473.7M backlog directly reinforce the candidate's position as a critical bottleneck solver for AI packaging capacity constraints.
Material risks
- 1HBM customers transitioning to HBM4 may internally develop alternative bonding/debonding processes or shift to competing layer-release platforms from vendors like EV Group or Besi.
- 2Internal production capacity constraints limit 2026 backlog conversion, creating revenue delivery friction against a rich valuation (forward PEG of 4.2).
AI verdict council
Each pick is reviewed independently by 3 models before any order. 1 of 3 voted to proceed.