BN · rank #5 · 2026-10-23
SMHN
XETRA · EUR · $1.10B (USD)
The exact numbers the algorithm saw.
| Composite score Z-score blend of the factors below; drives the rank. | 0.84 |
|---|---|
| Forward revenue growth Consensus forward revenue growth. | +37.9% |
| Forward net margin Consensus forward net margin. | +9.8% |
| Net margin TTM Trailing twelve month net margin. | +5.9% |
| Margin expansion Forward minus trailing net margin (percentage points). | +3.9% |
| Forward PEG Forward P/E to growth. Below 1 is cheap for the growth. | 4.20 |
| Debt / FCF Net debt relative to free cash flow. Lower is safer. | 2.21× |
| Analyst upside Spread between the consensus 12m target and the current price. | +115.7% |
| Last EPS surprise Most recent reported EPS versus consensus. | -27% |
| Market cap (USD) | $1.10B |
The AI research card
Independent qualitative review of each pick before the order is placed. On the rare day the research service is unavailable, the paper book trades on the quant ranking alone and no card appears here.
Summary
SÜSS MicroTec makes semiconductor equipment for advanced packaging, especially temporary bonding/debonding, hybrid bonding and coater/developer tools used in AI-chip and HBM supply chains.
Rationale
The stock fits a bottleneck-solver thesis because SÜSS is a market leader in a critical wafer-thinning/stacking step, has record H1 2026 orders and a large backlog that gives real revenue visibility.
Material risks
- 1HBM customers or rivals could internalize or substitute temporary bonding/debonding and hybrid-bonding steps, weakening SÜSS’s bottleneck position and requalifying it out of key accounts.
- 2Capacity constraints and the rich 4.2x forward PEG leave little room if backlog conversion slips, export controls bite, or the 2027 order mix pushes too much revenue out of 2026.
AI verdict council
Each pick is reviewed independently by 3 models before any order. 1 of 3 voted to proceed.